For those of you waiting for your G5 ...
One of the interesting things about the G5 processor is its use of a dual damascene fabrication process. It turns out that Damascus swords pioneered the technique of forge welding two dissimilar metals - it was perfected in Toledo where beautiful examples have been made (my sister gave me a wonderful dagger crafted with the technique). So what does this mean in the IC world?
It turns out that IBM developed a technique of inlaying metal interconnections five years ago when the copper etch process became impractical. Specifically the process consists of etching a high aspect ratio trench, electrochemical plating copper and polishing off the overfill. A tungsten plug connects silicon to a lower metal layer. The term "dual" refers to a second channel created within the trench. (this isn't a precise description, but that would be technical)
So the metallurgy in the new Macintosh G5 goes back to a process developed in Syria 2500 years ago and perfected in Spain a few thousand years later.
(I really want a G5 to go with my dagger:-)
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